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Laser micro machining techniques are currently used by the automobile and medical industries as well as in the production of semiconductors and solar cell processing. Lasers for micro machining offer a wide range of wavelengths, pulse duration (From femto second to microsecond) and repetition rates (from single pulse to Megahertz). These attributes allow micro-machining with high resolution in depth and lateral dimensions.
The ﬁeld of micro-machining includes manufacturing methods like drilling, cutting, welding as well as ablation and material surface texturing, whereby it is possible to achieve very ﬁne surface structures ranging in the micrometer domain. Such processes require a rapid heating, melting and evaporation of the material. The use of extremely short nano- and pico-second and even femto-second pulse duration helps to minimise the thermal effects such as melting and burr formation thus eliminating the need for any post processing measures.