|Laser Beam Mode||TEM00|
|Average Power||Up to 2W|
|Positioning||Visible Red Diode Light|
|Input Power||115/230VAC 50/60Hz|
|System Power Consumption||< 950W|
|Cooling||Air Cooled, active thermo-electric/Water Cooled|
|Operating Temperature Range||18° to 35°C (64° to 95°F)|
|Humidity||10% to 85% Non-condensing|
The UV Laser Marking with its wavelength 355nm is suitable for marking plastics (ABS, PA) due to a high repetition rate. The UV laser wavelength is suitable and versatile in marking a wide range of materials and is perfect for “cold marking” applications where heat zones are not allowed.
UV Laser mark at very high speeds which are indispensable for short cycle times in industrial manufacturing environments. With high peak powers they are most suitable for fine marking and structuring without thermal impact on glass applications and/or ceramics.
The UV laser marking will mark plastics and silicon materials without the need of additives and will also mark glass with drastically reduced risk of micro fracture. The excellent beam quality also affords this laser the ability to be utilized in micro marking applications such as electronics, circuit boards and microchips in addition to solar panels and precise medical marking applications.
They also provide an excellent quality for classical laser marking applications and micro material processing.
|Standard Lens Configurations-Focal Length|